FinFET Device and Method

ABSTRACT

A device includes a fin over a substrate, the fin including a first end and a second end, wherein the first end of the fin has a convex profile, an isolation region adjacent the fin, a gate structure along sidewalls of the fin and over the top surface of the fin, a gate spacer laterally adjacent the gate structure, and an epitaxial region adjacent the first end of the fin.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as, for example, personal computers, cell phones, digital cameras,and other electronic equipment. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductor layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area. However, asthe minimum features sizes are reduced, additional problems arise thatshould be addressed.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates an example of a FinFET in a three-dimensional view,in accordance with some embodiments.

FIGS. 2, 3, 4, 5, 6, 7, 8A, 8B, 9A, 9B, 9C, 10A, 10B, 10C, 11A, 11B,11C, 11D, 12A, 12B, 12C, 12D, 12E, 13A, 13B, 14A, 14B, 15A, 15B, 16A,16B, 16C, 17A, 17B, 18A, and 18B are cross-sectional views or plan viewsof intermediate stages in the manufacturing of FinFETs, in accordancewith some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Various embodiments are discussed herein in a particular context,namely, reshaping semiconductor fins prior to forming epitaxialsource/drain regions in a FinFET transistor. However, variousembodiments may be applied to other semiconductor devices/processes,such as planar transistors. In some embodiments, recesses for theepitaxial source/drain regions are formed in a fin such that each finhas a round or tapered end at the recesses. In some embodiments, a firstetching process is performed to form recesses in the fin, and then asecond etching process is performed to reshape the recesses (and thusreshape the fins). In the reshaping etch, the sides of the fin areetched more than the center of the fin to form the rounded end profile.In this manner, the overall channel lengths of the fins can be reduced.By forming fins having a rounded profile at the epitaxial source/drainregions, the channel resistance of the fins can be reduced withoutsignificantly increasing short-channel effects.

FIG. 1 illustrates an example of a FinFET in a three-dimensional view,in accordance with some embodiments. The FinFET comprises a fin 52 on asubstrate 50 (e.g., a semiconductor substrate). Isolation regions 56 aredisposed in the substrate 50, and the fin 52 protrudes above and frombetween neighboring isolation regions 56. Although the isolation regions56 are described/illustrated as being separate from the substrate 50, asused herein the term “substrate” may be used to refer to just thesemiconductor substrate or a semiconductor substrate inclusive ofisolation regions. Additionally, although the fin 52 is illustrated as asingle, continuous material as the substrate 50, the fin 52 and/or thesubstrate 50 may comprise a single material or a plurality of materials.In this context, the fin 52 refers to the portion extending between theneighboring isolation regions 56.

A gate dielectric layer 92 is along sidewalls and over a top surface ofthe fin 52, and a gate electrode 94 is over the gate dielectric layer92. Source/drain regions 82 are disposed in opposite sides of the fin 52with respect to the gate dielectric layer 92 and gate electrode 94. FIG.1 further illustrates reference cross-sections that are used in laterfigures. Cross-section A-A is along a longitudinal axis of the gateelectrode 94 and in a direction, for example, perpendicular to thedirection of current flow between the source/drain regions 82 of theFinFET. Cross-section B-B is perpendicular to cross-section A-A and isalong a longitudinal axis of the fin 52 and in a direction of, forexample, a current flow between the source/drain regions 82 of theFinFET. Cross-section E-E is parallel to cross-section A-A and extendsthrough a source/drain region of the FinFET. Subsequent figures refer tothese reference cross-sections for clarity.

Some embodiments discussed herein are discussed in the context ofFinFETs formed using a gate-last process. In other embodiments, agate-first process may be used. Also, some embodiments contemplateaspects used in planar devices, such as planar FETs.

FIGS. 2 through 18B are cross-sectional views of intermediate stages inthe manufacturing of FinFETs, in accordance with some embodiments. FIGS.2 through 7 illustrate reference cross-section A-A illustrated in FIG.1, except for multiple fins/FinFETs. FIGS. 8A, 9A, 10A, 11A, 12A, 13A,14A, 15A, 16A, 17A, and 18A are illustrated along referencecross-section A-A illustrated in FIG. 1, and FIGS. 8B, 9B, 10B, 11B,12B, 13B, 14B, 14C, 15B, 16B, 17B, and 18B are illustrated along asimilar cross-section B-B illustrated in FIG. 1, except for multiplefins/FinFETs. FIGS. 9C, 10C, 11C, 11D, and 12C are illustrated in a planview. FIGS. 12D and 12E are illustrated along reference cross-sectionE-E illustrated in FIG. 1, except for multiple fins/FinFETs.

In FIG. 2, a substrate 50 is provided. The substrate 50 may be asemiconductor substrate, such as a bulk semiconductor, asemiconductor-on-insulator (SOI) substrate, or the like, which may bedoped (e.g., with a p-type or an n-type dopant) or undoped. Thesubstrate 50 may be a wafer, such as a silicon wafer. Generally, an SOIsubstrate is a layer of a semiconductor material formed on an insulatorlayer. The insulator layer may be, for example, a buried oxide (BOX)layer, a silicon oxide layer, or the like. The insulator layer isprovided on a substrate, typically a silicon or glass substrate. Othersubstrates, such as a multi-layered or gradient substrate may also beused. In some embodiments, the semiconductor material of the substrate50 may include silicon; germanium; a compound semiconductor includingsilicon carbide, gallium arsenide, gallium phosphide, indium phosphide,indium arsenide, and/or indium antimonide; an alloy semiconductorincluding silicon-germanium, gallium arsenide phosphide, aluminum indiumarsenide, aluminum gallium arsenide, gallium indium arsenide, galliumindium phosphide, and/or gallium indium arsenide phosphide; orcombinations thereof.

The substrate 50 has a region 50N and a region 50P. The region 50N canbe for forming n-type devices, such as NMOS transistors, e.g., n-typeFinFETs. The region 50P can be for forming p-type devices, such as PMOStransistors, e.g., p-type FinFETs. The region 50N may be physicallyseparated from the region 50P (as illustrated by divider 51), and anynumber of device features (e.g., other active devices, doped regions,isolation structures, etc.) may be disposed between the region 50N andthe region 50P.

In FIG. 3, fins 52 are formed in the substrate 50. The fins 52 aresemiconductor strips. In some embodiments, the fins 52 may be formed inthe substrate 50 by etching trenches in the substrate 50. The etchingmay be any acceptable etch process, such as a reactive ion etch (RIE),neutral beam etch (NBE), the like, or a combination thereof. The etchmay be anisotropic.

Fins 52 may be patterned by any suitable method. For example, fins 52may be patterned using one or more photolithography processes, includingdouble-patterning or multi-patterning processes. Generally,double-patterning or multi-patterning processes combine photolithographyand self-aligned processes, allowing patterns to be created that have,for example, pitches smaller than what is otherwise obtainable using asingle, direct photolithography process. For example, in one embodiment,a sacrificial layer is formed over a substrate and patterned using aphotolithography process. Spacers are formed alongside the patternedsacrificial layer using a self-aligned process. The sacrificial layer isthen removed, and the remaining spacers may then be used to pattern thefins. In some embodiments, the mask (or other layer) may remain on fins52. In some embodiments, fins 52 may be formed having a width that isbetween about 3 nm and about 15 nm, though fins 52 may be formed havingother widths.

In FIG. 4, an insulation material 54 is formed over the substrate 50 andbetween neighboring fins 52. The insulation material 54 may be an oxide,such as silicon oxide, a nitride, the like, or a combination thereof,and may be formed by a high density plasma chemical vapor deposition(HDP-CVD), a flowable CVD (FCVD) (e.g., a CVD-based material depositionin a remote plasma system and post curing to make it convert to anothermaterial, such as an oxide), the like, or a combination thereof. Otherinsulation materials formed by any acceptable process may be used. Inthe illustrated embodiment, the insulation material 54 is silicon oxideformed by a FCVD process. An anneal process may be performed once theinsulation material is formed. In an embodiment, the insulation material54 is formed such that excess insulation material 54 covers the fins 52.Although the insulation material 54 is illustrated as a single layer,some embodiments may utilize multiple layers. For example, in someembodiments a liner (not shown) may first be formed along a surface ofthe substrate 50 and the fins 52. Thereafter, a fill material, such asthose discussed above may be formed over the liner.

In FIG. 5, a removal process is applied to the insulation material 54 toremove excess insulation material 54 over the fins 52. In someembodiments, a planarization process such as a chemical mechanicalpolish (CMP), an etch-back process, combinations thereof, or the likemay be utilized. The planarization process exposes the fins 52 such thattop surfaces of the fins 52 and the insulation material 54 are levelafter the planarization process is complete. In embodiments in which amask remains on the fins 52, the planarization process may expose themask or remove the mask such that top surfaces of the mask or the fins52, respectively, and the insulation material 54 are level after theplanarization process is complete.

In FIG. 6, the insulation material 54 is recessed to form Shallow TrenchIsolation (STI) regions 56. The insulation material 54 is recessed suchthat upper portions of fins 52 in the region 50N and in the region 50Pprotrude from between neighboring STI regions 56. Further, the topsurfaces of the STI regions 56 may have a flat surface as illustrated, aconvex surface, a concave surface (such as dishing), or a combinationthereof. The top surfaces of the STI regions 56 may be formed flat,convex, and/or concave by an appropriate etch. The STI regions 56 may berecessed using an acceptable etching process, such as one that isselective to the material of the insulation material 54 (e.g., etchesthe material of the insulation material 54 at a faster rate than thematerial of the fins 52). For example, an oxide removal using, forexample, dilute hydrofluoric (dHF) acid may be used.

The process described with respect to FIGS. 2 through 6 is just oneexample of how the fins 52 may be formed. In some embodiments, the finsmay be formed by an epitaxial growth process. For example, a dielectriclayer can be formed over a top surface of the substrate 50, and trenchescan be etched through the dielectric layer to expose the underlyingsubstrate 50. Homoepitaxial structures can be epitaxially grown in thetrenches, and the dielectric layer can be recessed such that thehomoepitaxial structures protrude from the dielectric layer to formfins. Additionally, in some embodiments, heteroepitaxial structures canbe used for the fins 52. For example, the fins 52 in FIG. 5 can berecessed, and a material different from the fins 52 may be epitaxiallygrown over the recessed fins 52. In such embodiments, the fins 52comprise the recessed material as well as the epitaxially grown materialdisposed over the recessed material. In an even further embodiment, adielectric layer can be formed over a top surface of the substrate 50,and trenches can be etched through the dielectric layer. Heteroepitaxialstructures can then be epitaxially grown in the trenches using amaterial different from the substrate 50, and the dielectric layer canbe recessed such that the heteroepitaxial structures protrude from thedielectric layer to form the fins 52. In some embodiments wherehomoepitaxial or heteroepitaxial structures are epitaxially grown, theepitaxially grown materials may be in situ doped during growth, whichmay obviate prior and subsequent implantations although in situ andimplantation doping may be used together.

Still further, it may be advantageous to epitaxially grow a material inregion 50N (e.g., an NMOS region) different from the material in region50P (e.g., a PMOS region). In various embodiments, upper portions of thefins 52 may be formed from silicon-germanium (Si_(x)Ge_(1-x), where xcan be in the range of 0 to 1), silicon carbide, pure or substantiallypure germanium, a III-V compound semiconductor, a II-VI compoundsemiconductor, or the like. For example, the available materials forforming III-V compound semiconductor include, but are not limited to,indium arsenide, aluminum arsenide, gallium arsenide, indium phosphide,gallium nitride, indium gallium arsenide, indium aluminum arsenide,gallium antimonide, aluminum antimonide, aluminum phosphide, galliumphosphide, and the like.

Further in FIG. 6, appropriate wells (not shown) may be formed in thefins 52 and/or the substrate 50. In some embodiments, a P well may beformed in the region 50N, and an N well may be formed in the region 50P.In some embodiments, a P well or an N well are formed in both the region50N and the region 50P.

In the embodiments with different well types, the different implantsteps for the region 50N and the region 50P may be achieved using aphotoresist or other masks (not shown). For example, a photoresist maybe formed over the fins 52 and the STI regions 56 in the region 50N. Thephotoresist is patterned to expose the region 50P of the substrate 50,such as a PMOS region. The photoresist can be formed by using a spin-ontechnique and can be patterned using acceptable photolithographytechniques. Once the photoresist is patterned, an n-type impurityimplant is performed in the region 50P, and the photoresist may act as amask to substantially prevent n-type impurities from being implantedinto the region 50N, such as an NMOS region. The n-type impurities maybe phosphorus, arsenic, antimony, or the like implanted in the region toa concentration of equal to or less than 10¹⁸ cm⁻³, such as betweenabout 10¹⁶ cm⁻³ and about 10¹⁸ cm⁻³. After the implant, the photoresistis removed, such as by an acceptable ashing process.

Following the implanting of the region 50P, a photoresist is formed overthe fins 52 and the STI regions 56 in the region 50P. The photoresist ispatterned to expose the region 50N of the substrate 50, such as the NMOSregion. The photoresist can be formed by using a spin-on technique andcan be patterned using acceptable photolithography techniques. Once thephotoresist is patterned, a p-type impurity implant may be performed inthe region 50N, and the photoresist may act as a mask to substantiallyprevent p-type impurities from being implanted into the region 50P, suchas the PMOS region. The p-type impurities may be boron, boron fluoride,indium, or the like implanted in the region to a concentration of equalto or less than 10¹⁸ cm⁻³, such as between about 10¹⁶ cm⁻³ and about10¹⁸ cm⁻³. After the implant, the photoresist may be removed, such as byan acceptable ashing process.

After the implants of the region 50N and the region 50P, an anneal maybe performed to repair implant damage and to activate the p-type and/orn-type impurities that were implanted. In some embodiments, the grownmaterials of epitaxial fins may be in situ doped during growth, whichmay obviate the implantations, although in situ and implantation dopingmay be used together.

In FIG. 7, a dummy dielectric layer 60 is formed on the fins 52. Thedummy dielectric layer 60 may be, for example, silicon oxide, siliconnitride, a combination thereof, or the like, and may be deposited orthermally grown according to acceptable techniques. A dummy gate layer62 is formed over the dummy dielectric layer 60, and a mask layer 64 isformed over the dummy gate layer 62. The dummy gate layer 62 may bedeposited over the dummy dielectric layer 60 and then planarized, suchas by a CMP. The mask layer 64 may be deposited over the dummy gatelayer 62. The dummy gate layer 62 may be a conductive or non-conductivematerial and may be selected from a group including amorphous silicon,polycrystalline-silicon (polysilicon), poly-crystallinesilicon-germanium (poly-SiGe), metallic nitrides, metallic silicides,metallic oxides, and metals. The dummy gate layer 62 may be deposited byphysical vapor deposition (PVD), CVD, sputter deposition, or othertechniques known and used in the art for depositing the selectedmaterial. The dummy gate layer 62 may be made of other materials thathave a high etching selectivity from the etching of isolation regions.The mask layer 64 may include, for example, silicon nitride, siliconoxynitride, or the like. In this example, a single dummy gate layer 62and a single mask layer 64 are formed across the region 50N and theregion 50P. It is noted that the dummy dielectric layer 60 is showncovering only the fins 52 for illustrative purposes only. In someembodiments, the dummy dielectric layer 60 may be deposited such thatthe dummy dielectric layer 60 covers the STI regions 56, extendingbetween the dummy gate layer 62 and the STI regions 56.

FIGS. 8A through 18B illustrate various additional steps in themanufacturing of embodiment devices. FIGS. 8A through 18B illustratefeatures in either of the region 50N or the region 50P. For example, thestructures illustrated in FIGS. 8A through 18B may be applicable to boththe region 50N and the region 50P. Differences (if any) in thestructures of the region 50N and the region 50P are described in thetext accompanying each figure.

In FIGS. 8A and 8B, the mask layer 64 (see FIG. 7) may be patternedusing acceptable photolithography and etching techniques to form masks74. The pattern of the masks 74 then may be transferred to the dummygate layer 62. In some embodiments (not illustrated), the pattern of themasks 74 may also be transferred to the dummy dielectric layer 60 by anacceptable etching technique to form dummy gates 72. The dummy gates 72cover respective channel regions 58 of the fins 52. The pattern of themasks 74 may be used to physically separate each of the dummy gates 72from adjacent dummy gates 72. The dummy gates 72 may also have alengthwise direction substantially perpendicular to the lengthwisedirection of respective epitaxial fins 52. A mask 74 on a dummy gate 72may also be referred to as a “dummy gate structure” or a “dummy gatestack.”

Further in FIGS. 8A and 8B, gate seal spacers 80 can be formed onexposed surfaces of the dummy gates 72, the masks 74, and/or the fins52. A thermal oxidation or a deposition followed by an anisotropic etchmay form the gate seal spacers 80. The gate seal spacers 80 may beformed of silicon oxide, silicon nitride, silicon oxynitride, or thelike.

After the formation of the gate seal spacers 80, implants for lightlydoped source/drain (LDD) regions (not explicitly illustrated) may beperformed. In the embodiments with different device types, similar tothe implants discussed above in FIG. 6, a mask, such as a photoresist,may be formed over the region 50N, while exposing the region 50P, andappropriate type (e.g., p-type) impurities may be implanted into theexposed fins 52 in the region 50P. The mask may then be removed.Subsequently, a mask, such as a photoresist, may be formed over theregion 50P while exposing the region 50N, and appropriate typeimpurities (e.g., n-type) may be implanted into the exposed fins 52 inthe region 50N. The mask may then be removed. The n-type impurities maybe the any of the n-type impurities previously discussed, and the p-typeimpurities may be the any of the p-type impurities previously discussed.The lightly doped source/drain regions may have a concentration ofimpurities of from about 10¹⁵ cm⁻³ to about 10¹⁹ cm⁻³. An anneal may beused to repair implant damage and to activate the implanted impurities.

In FIGS. 9A, 9B, and 9C, gate spacers 86 are formed on the gate sealspacers 80 along sidewalls of the dummy gates 72 and the masks 74. FIG.9C illustrates a plan view of multiple fins 52 and multiple dummy gatestructures (masks 74 are shown). An example cross-sectional view asshown in FIG. 9B is labeled in FIG. 9C. For clarity, some features arenot explicitly shown in FIG. 9C. In some embodiments, the gate spacers86 may be formed by conformally depositing an insulating material andsubsequently anisotropically etching the insulating material. Theinsulating material of the gate spacers 86 may be silicon oxide, siliconnitride, silicon oxynitride, silicon carbonitride, a combinationthereof, or the like.

It is noted that the above disclosure generally describes a process offorming spacers and LDD regions. Other processes and sequences may beused. For example, fewer or additional spacers may be utilized,different sequence of steps may be utilized (e.g., the gate seal spacers80 may not be etched prior to forming the gate spacers 86, yielding“L-shaped” gate seal spacers, spacers may be formed and removed, and/orthe like. In some embodiments, gate spacers 86 may include multiplelayers. Furthermore, the n-type and p-type devices may be formed using adifferent structures and steps. For example, LDD regions for n-typedevices may be formed prior to forming the gate seal spacers 80 whilethe LDD regions for p-type devices may be formed after forming the gateseal spacers 80.

In FIG. 10A-C through FIGS. 12A-E, epitaxial source/drain regions 82 areformed in the fins 52, according to some embodiments. FIGS. 10A, 11A,and 12A are illustrated along reference cross-section A-A. FIGS. 10B,11B, and 12B are illustrated along reference cross-section B-B. FIGS.10C, 11C, 11D, and 12C are illustrated in a plan view. FIGS. 12D and 12Eare illustrated along reference cross-section E-E. The epitaxialsource/drain regions 82 (see FIGS. 12A-E) are formed in the fins 52 suchthat each dummy gate 72 is disposed between respective neighboring pairsof the epitaxial source/drain regions 82. In some embodiments, theepitaxial source/drain regions 82 may extend through the LDD regions. Insome embodiments, the gate seal spacers 80 and gate spacers 86 are usedto separate the epitaxial source/drain regions 82 from the dummy gates72.

Referring first to FIGS. 10A-C, a first patterning process is performedon the fins 52 to form recesses 120 in source/drain regions of fins 52.During the formation of recesses 120, the region 50N or the region 50Pmay be masked by a mask (not shown), or the recesses 120 may be formedin the region 50N and the region 50P at the same time. The firstpatterning process may be performed in a manner such that the recesses120 are formed between neighboring dummy gate structures (in interiorregions of the fins 52), or between an isolation region 56 and adjacentdummy gate structures (in end regions of the fins 52). In someembodiments, the first patterning process may include a suitableanisotropic dry etching process using the dummy gate structures, gatespacers 86, and/or isolation regions 56 as a combined mask. In someembodiments, the recesses 120 may be formed having a vertical depthbetween about 40 nm and about 80 nm from top surfaces of the fins 52.

In some embodiments, after the first patterning process, upper sidewallsof the recesses 120 (e.g., sidewalls at or near the channel regions 58of the fins 52) may be approximately aligned with the bottom edges ofthe gate spacers 86 in a plan view, as shown in FIGS. 10B-C. In otherembodiments, after the first patterning process, the upper sidewalls ofthe recesses 120 may be offset from the bottom edges of the gate spacers86. For example, the recesses 120 may extend beneath (e.g., “undercut”)the gate spacers 86 or may extend beneath the dummy gate structures. Insome embodiments, after the first patterning process, the uppersidewalls of the recesses 120 may have an approximately flat profile ina plan view, as shown in FIG. 10C. For example, the channel regions 58extending between the recesses 120 may have approximately flat ends. Inother embodiments, after the first patterning process, the uppersidewalls of the recesses 120 may have a different shape than shown inFIG. 10C. In some embodiments, after the first patterning process, thechannel regions 58 between the recesses 120 may have a length L1 that isbetween about 10 nm and about 50 nm.

In some embodiments, the first patterning process includes a plasmaetching process. The process gases used in the plasma etching processmay include etchant gases such as H₂, HCl, HBr, Cl₂, CH₄, C₂H₄, SF₆, thelike, other gases, or a combination of gases. In some embodiments,carrier gases, such as N₂, Ar, He, Xe, or the like, may be used to carryprocess gases (e.g., etchant gases or other gases) into the processingchamber. The process gases may be flowed into the processing chamber ata rate between about 10 sccm and about 3000 sccm. For example, theetchant gases may be flowed into the processing chamber or plasmageneration chamber at a rate between about 10 sccm and about 1000 sccm,such as about 100 sccm. Carrier gases may be flowed into the processingchamber at a rate between about 100 sccm and about 35000 sccm, such asabout 5000 sccm. In some embodiments, the plasma etching process isperformed at a temperature between about 50° C. and about 400° C., suchas about 330° C. A pressure in the processing chamber may be betweenabout 1 mTorr and about 600 mTorr, such as about 100 mTorr. In someembodiments, the plasma etching process includes multiple steps.

Turning now to FIGS. 11A-D, a second patterning process is performed onthe fins 52 to form reshaped recesses 122 from the recesses 120, inaccordance with some embodiments. FIG. 11D illustrates a close-up planview of a single fin 52 such as shown in FIG. 11C. The second patterningprocess includes an etching process (e.g., an anisotropic etchingprocess) that etches surfaces of the recesses 120 to increase the sizeof the recesses 120 and change the shape of the recesses 120. Recesses120 that have been reshaped in this manner by the second patterningprocess are referred to as reshaped recesses 122. In some embodiments,the second patterning process may etch between about 0.1 nm and about 5nm into surfaces of the recesses 120 to form the reshaped recesses 122.The second patterning process may etch some surfaces of the recesses 120more than other surfaces of the recesses 120. For example, the secondpatterning process may etch the sidewalls of the recesses 120 more thanthe bottom surfaces of the recesses 120. In some embodiments, the secondpatterning process may be controlled to etch the sidewalls of therecesses 120 more than the bottom surfaces, about the same as the bottomsurfaces, or less than the bottom surfaces. In some embodiments, thereshaped recesses 122 may have a vertical depth between about 0.1 nm andabout 10 nm from the top surface of the fins 52.

In some embodiments, the second patterning process etches surfaceregions of the recesses 120 that are adjacent the gate spacers 86 (“edgeregions”) more than surface regions of the recesses 120 that are awayfrom the gate spacers 86 (“center regions”). In other words, the secondpatterning process etches regions of a fin 52 that are near sidewalls ofthe fin 52 more than the second patterning process etches regions of thefin 52 that are away from sidewalls of the fin 52. In this manner, afterthe second patterning process, edge regions of the reshaped recesses 122may extend farther under the gate spacers 86 than center regions of thereshaped recesses 122. As such, after the second patterning process,upper sidewalls of the reshaped recesses 122 may have a round (e.g.,“U-shaped”) or tapered profile in a plan view, as shown in FIGS. 11C-D.For example, the channel regions 58 extending between the reshapedrecesses 122 may have rounded or tapered ends. In some embodiments, edgeregions of the reshaped recesses 122 extend under the dummy gatestructures.

Referring to FIG. 11D, in some embodiments, center regions of thereshaped recesses 122 extend a distance D1 under the gate spacers 86 andedge regions of the reshaped recesses 122 extend a distance D2 under thegate spacers 86 that is greater than distance D1. In some embodiments,distance D1 may be between about 0 nm and about 10 nm. In someembodiments, distance D2 may be between about 0.1 nm and about 5 nmgreater than distance D1. In some embodiments, after the secondpatterning process, the channel regions 58 between the reshaped recesses122 may have a center length L2 that is between about 10 nm and about 45nm and an edge length L3 that is less than L2 and that is between about9.5 nm and about 40 nm.

In some cases, reducing the length of a channel region can reduce theresistance (e.g., “channel resistance”) of the channel regions, whichcan improve device performance. For example, a lower channel resistancecan increase the on-current of a FinFET device. By using the secondpatterning process to reduce the edge length L3 of the channel regions58, the resistance of the channel regions 58 can thus be reduced.Additionally, by forming the channel regions 58 having rounded ends, therelatively longer center length L2 of the channel regions 58 allows formore control over short-channel effects. In this manner, by forming thechannel regions 58 having rounded ends as described, the resistance ofthe channel regions 58 can be reduced without undesirably increasingshort-channel effects.

In some embodiments, the second patterning process includes a plasmaetching process. The process gases used in the plasma etching processmay include etchant gases such as H₂, HCl, HBr, Cl₂, CH₄, C₂H₄, SF₆, thelike, other gases, or a combination of gases. In some embodiments,carrier gases, such as N₂, Ar, He, Xe, or the like, may be used to carryprocess gases (e.g., etchant gases or other gases) into the processingchamber. The process gases may be flowed into the processing chamber ata rate between about 10 sccm and about 3000 sccm. For example, theetchant gases may be flowed into the processing chamber or plasmageneration chamber at a rate between about 10 sccm and about 1000 sccm,such as about 100 sccm. Carrier gases may be flowed into the processingchamber at a rate between about 10 sccm and about 35000 sccm, such asabout 500 sccm. In some embodiments, the plasma etching process isperformed at a temperature between about 50° C. and about 400° C., suchas about 330° C. A pressure in the processing chamber may be betweenabout 1 mTorr and about 600 mTorr, such as about 100 mTorr. In someembodiments, the plasma etching process is performed for a time betweenabout 5 seconds and about 300 seconds. In some embodiments, the plasmaetching process includes multiple steps, which may include steps havingdifferent plasma etching process parameters or different mixtures ofetchant gases.

The plasma etching process parameters and etchant gases for the secondpatterning process are selected such that edge regions of the recesses120 are etched at a greater rate than the center regions of the recesses120. For example, the edge regions may be etched at a rate that isbetween about 100% and about 300% of the rate that the center regionsare etched. In some cases, defects and interfacial states at theinterface between the semiconductor material of the fins 52 and thedielectric material of the gate spacers 86 can cause the semiconductormaterial near the interfaces to be etched at a greater rate than bulksemiconductor material. For example, a plasma etching process includingsuch as that described herein can have an etch selectivity over edgeregions over center regions. In this manner, the second patterningprocess can be controlled to control the etching selectivity of edgeregions over center regions, and thus control the shape of the channelregions 58.

Turning now to FIGS. 12A, 12B, and 12C, epitaxial source/drain regions82 are formed in the fins 52 such that each dummy gate structure isdisposed between respective neighboring pairs of the epitaxialsource/drain regions 82. In some embodiments, the epitaxial source/drainregions 82 may extend into, and may also penetrate through, the fins 52.In some embodiments, the gate spacers 86 are used to separate theepitaxial source/drain regions 82 from the dummy gate structures by anappropriate lateral distance so that the epitaxial source/drain regions82 do not short out subsequently formed gates of the resulting FinFETs.As shown in FIG. 12C, due to the shape of the reshaped recesses 122,portions of the epitaxial source/drain regions 82 adjacent edge regionsof the fins 52 extend farther under the gate spacers 86 than portions ofthe epitaxial source/drain regions 82 adjacent center regions of thefins 52.

Then, the epitaxial source/drain regions 82 in the region 50N areepitaxially grown in the reshaped recesses 120. The epitaxialsource/drain regions 82 may include any acceptable material appropriatefor n-type FinFETs. For example, if the fins 52 are silicon, theepitaxial source/drain regions 82 in the region 50N may includematerials exerting a tensile strain in the channel regions 58 of thefins 52, such as silicon, silicon carbide, phosphorous-doped siliconcarbide, silicon phosphide, the like, or a combination thereof. Theepitaxial source/drain regions 82 in the region 50N may have surfacesraised from respective surfaces of the fins 52 and may have facets.

The epitaxial source/drain regions 82 in the region 50P, e.g., the PMOSregion, may be formed by masking the region 50N, e.g., the NMOS region,and epitaxially growing the epitaxial source/drain regions 82 in thereshaped recesses 122 of the region 50P. The epitaxial source/drainregions 82 may include any acceptable material appropriate for p-typeFinFETs. For example, if the fins 52 are silicon, the epitaxialsource/drain regions 82 in the region 50P may comprise materialsexerting a compressive strain in the channel regions 58, such assilicon-germanium, boron doped silicon-germanium, germanium, germaniumtin, the like, or a combination thereof. The epitaxial source/drainregions 82 in the region 50P may also have surfaces raised fromrespective surfaces of the fins 52 and may have facets.

The epitaxial source/drain regions 82 and/or the fins 52 may beimplanted with dopants to form source/drain regions, similar to theprocess previously discussed for forming lightly-doped source/drainregions, followed by an anneal. The epitaxial source/drain regions 82may have an impurity concentration of between about 10¹⁹ cm⁻³ and about10²¹ cm⁻³. The n-type and/or p-type impurities for the epitaxialsource/drain regions 82 may be any of the impurities previouslydiscussed. In some embodiments, the epitaxial source/drain regions 82may be in situ doped during growth.

As a result of the epitaxy processes used to form the epitaxialsource/drain regions 82 in the region 50N and the region 50P, uppersurfaces of the epitaxial source/drain regions have facets which expandlaterally outward beyond sidewalls of fins 52. In some embodiments,these facets cause adjacent the epitaxial source/drain regions 82 of asame FinFET to merge as illustrated by FIGS. 12C and 12D. In otherembodiments, adjacent epitaxial source/drain regions 82 remain separatedafter the epitaxy process is completed, as illustrated by FIG. 12E. Inthe embodiments illustrated in FIGS. 12D and 12E, the gate spacers 86are formed covering a portion of the sidewalls of the fins 52 thatextend above the STI regions 56, thereby blocking the epitaxial growth.In some other embodiments, the spacer etch used to form the gate spacers86 may be adjusted to remove the spacer material to allow theepitaxially grown region to extend to the surface of the STI region 56.

In FIGS. 13A and 13B, a first interlayer dielectric (ILD) 88 isdeposited over the structure illustrated in FIGS. 12A-E. The first ILD88 may be formed of a dielectric material, and may be deposited by anysuitable method, such as CVD, plasma-enhanced CVD (PECVD), or FCVD.Dielectric materials may include phospho-silicate glass (PSG),boro-silicate glass (BSG), boron-doped phospho-silicate glass (BPSG),undoped silicate glass (USG), or the like. Other insulation materialsformed by any acceptable process may be used. In some embodiments, acontact etch stop layer (CESL) 87 is disposed between the first ILD 88and the epitaxial source/drain regions 82, the masks 74, and the gatespacers 86. The CESL 87 may comprise a dielectric material, such as,silicon nitride, silicon oxide, silicon oxynitride, or the like, havinga different etch rate than the material of the overlying first ILD 88.

In FIGS. 14A and 14B, a planarization process, such as a CMP, may beperformed to level the top surface of the first ILD 88 with the topsurfaces of the dummy gates 72 or the masks 74. The planarizationprocess may also remove the masks 74 on the dummy gates 72, and portionsof the gate seal spacers 80 and the gate spacers 86 along sidewalls ofthe masks 74. After the planarization process, top surfaces of the dummygates 72, the gate seal spacers 80, the gate spacers 86, and the firstILD 88 are level. Accordingly, the top surfaces of the dummy gates 72are exposed through the first ILD 88. In some embodiments, the masks 74may remain, in which case the planarization process levels the topsurface of the first ILD 88 with the top surfaces of the top surface ofthe masks 74.

In FIGS. 15A and 15B, the dummy gates 72, and the masks 74 if present,are removed in an etching step(s), so that recesses 90 are formed.Portions of the dummy dielectric layer 60 in the recesses 90 may also beremoved. In some embodiments, only the dummy gates 72 are removed andthe dummy dielectric layer 60 remains and is exposed by the recesses 90.In some embodiments, the dummy dielectric layer 60 is removed fromrecesses 90 in a first region of a die (e.g., a core logic region) andremains in recesses 90 in a second region of the die (e.g., aninput/output region). In some embodiments, the dummy gates 72 areremoved by an anisotropic dry etch process. For example, the etchingprocess may include a dry etch process using reaction gas(es) thatselectively etch the dummy gates 72 without etching the first ILD 88 orthe gate spacers 86. Each recess 90 exposes and/or overlies a channelregion 58 of a respective fin 52. Each channel region 58 is disposedbetween neighboring pairs of the epitaxial source/drain regions 82.During the removal, the dummy dielectric layer 60 may be used as an etchstop layer when the dummy gates 72 are etched. The dummy dielectriclayer 60 may then be optionally removed after the removal of the dummygates 72.

In FIGS. 16A and 16B, gate dielectric layers 92 and gate electrodes 94are formed for replacement gates. FIG. 16C illustrates a detailed viewof region 89 of FIG. 16B. Gate dielectric layers 92 are depositedconformally in the recesses 90, such as on the top surfaces and thesidewalls of the fins 52 and on sidewalls of the gate seal spacers80/gate spacers 86. The gate dielectric layers 92 may also be formed onthe top surface of the first ILD 88. In accordance with someembodiments, the gate dielectric layers 92 comprise silicon oxide,silicon nitride, or multilayers thereof. In some embodiments, the gatedielectric layers 92 include a high-k dielectric material, and in theseembodiments, the gate dielectric layers 92 may have a k value greaterthan about 7.0, and may include a metal oxide or a silicate of hafnium,aluminum, zirconium, lanthanum, manganese, barium, titanium, lead, andcombinations thereof. The formation methods of the gate dielectriclayers 92 may include Molecular-Beam Deposition (MBD), ALD, PECVD, andthe like. In embodiments where portions of the dummy gate dielectric 60remains in the recesses 90, the gate dielectric layers 92 include amaterial of the dummy gate dielectric 60 (e.g., SiO₂).

The gate electrodes 94 are deposited over the gate dielectric layers 92,respectively, and fill the remaining portions of the recesses 90. Thegate electrodes 94 may include a metal-containing material such astitanium nitride, titanium oxide, tantalum nitride, tantalum carbide,cobalt, ruthenium, aluminum, tungsten, combinations thereof, ormulti-layers thereof. For example, although a single layer gateelectrode 94 is illustrated in FIG. 16B, the gate electrode 94 maycomprise any number of liner layers 94A, any number of work functiontuning layers 94B, and a fill material 94C as illustrated by FIG. 16C.After the filling of the recesses 90, a planarization process, such as aCMP, may be performed to remove the excess portions of the gatedielectric layers 92 and the material of the gate electrodes 94, whichexcess portions are over the top surface of the ILD 88. The remainingportions of material of the gate electrodes 94 and the gate dielectriclayers 92 thus form replacement gates of the resulting FinFETs. The gateelectrodes 94 and the gate dielectric layers 92 may be collectivelyreferred to as a “gate stack.” The gate and the gate stacks may extendalong sidewalls of a channel region 58 of the fins 52.

The formation of the gate dielectric layers 92 in the region 50N and theregion 50P may occur simultaneously such that the gate dielectric layers92 in each region are formed from the same materials, and the formationof the gate electrodes 94 may occur simultaneously such that the gateelectrodes 94 in each region are formed from the same materials. In someembodiments, the gate dielectric layers 92 in each region may be formedby distinct processes, such that the gate dielectric layers 92 may bedifferent materials, and/or the gate electrodes 94 in each region may beformed by distinct processes, such that the gate electrodes 94 may bedifferent materials. Various masking steps may be used to mask andexpose appropriate regions when using distinct processes.

In FIGS. 17A and 17B, a second ILD 108 is deposited over the first ILD88. In some embodiment, the second ILD 108 is a flowable film formed bya flowable CVD method. In some embodiments, the second ILD 108 is formedof a dielectric material such as PSG, BSG, BPSG, USG, or the like, andmay be deposited by any suitable method, such as CVD and PECVD. Inaccordance with some embodiments, before the formation of the second ILD108, the gate stack (including a gate dielectric layer 92 and acorresponding overlying gate electrode 94) is recessed, so that a recessis formed directly over the gate stack and between opposing portions ofgate spacers 86, as illustrated in FIGS. 17A and 17B. A gate mask 96comprising one or more layers of dielectric material, such as siliconnitride, silicon oxynitride, or the like, is filled in the recess,followed by a planarization process to remove excess portions of thedielectric material extending over the first ILD 88. The subsequentlyformed gate contacts 110 (FIGS. 18A and 18B) penetrate through the gatemask 96 to contact the top surface of the recessed gate electrode 94.

In FIGS. 18A and 18B, gate contacts 110 and source/drain contacts 112are formed through the second ILD 108 and the first ILD 88 in accordancewith some embodiments. Openings for the source/drain contacts 112 areformed through the first and second ILDs 88 and 108, and openings forthe gate contact 110 are formed through the second ILD 108 and the gatemask 96. The openings may be formed using acceptable photolithographyand etching techniques. A liner, such as a diffusion barrier layer, anadhesion layer, or the like, and a conductive material are formed in theopenings. The liner may include titanium, titanium nitride, tantalum,tantalum nitride, or the like. The conductive material may be copper, acopper alloy, silver, gold, tungsten, cobalt, aluminum, nickel, or thelike. A planarization process, such as a CMP, may be performed to removeexcess material from a surface of the ILD 108. The remaining liner andconductive material form the source/drain contacts 112 and gate contacts110 in the openings. An anneal process may be performed to form asilicide at the interface between the epitaxial source/drain regions 82and the source/drain contacts 112. The source/drain contacts 112 arephysically and electrically coupled to the epitaxial source/drainregions 82, and the gate contacts 110 are physically and electricallycoupled to the gate electrodes 106. The source/drain contacts 112 andgate contacts 110 may be formed in different processes, or may be formedin the same process. Although shown as being formed in the samecross-sections, it should be appreciated that each of the source/draincontacts 112 and gate contacts 110 may be formed in differentcross-sections, which may avoid shorting of the contacts.

Various embodiments discussed herein allow for improved FinFETperformance. By forming the channel regions of the fins such that theends of the channel regions have rounded or tapered profiles, theoverall channel length of the fins can be reduced, which can reduce thechannel resistance of the fins. The overall channel length is reduceddue to the sidewalls (e.g. edge regions) of the fins being etched at thefin ends more than the center regions of the fins are etched at the finends. However, because the center regions of the fin ends protrudetoward the epitaxial source/drain regions, some short-channel effectsmay not be as severe as if the fins had flatter ends. Thus, the channelresistance of a FinFET device may be improved with less sensitivity toshort-channel effects.

In accordance with an embodiment, a method includes forming a fin over asubstrate, the fin including a first sidewall and a second sidewallopposite the first sidewall, forming an isolation region adjacent thefin, forming a dummy structure over the fin, forming a gate spacer on asidewall of the dummy structure, recessing the fin adjacent the dummystructure to form a first recess using a first etching process;,reshaping the first recess to form a reshaped recess using a secondetching process, wherein first regions of the reshaped recess that areadjacent the first sidewall and second regions of the reshaped recessthat are adjacent the second sidewall of the fin extend under the gatespacer a first distance, wherein third regions of the reshaped recessthat are between the first regions of the reshaped recess and the secondregions of the reshaped recess extend under the gate spacer a seconddistance, wherein the first distance is greater than the seconddistance, and epitaxially growing a source/drain region in the reshapedrecess. In an embodiment, the first distance is between 0.1 nm and 5 nmgreater than the second distance. In an embodiment, the second etchingprocess includes a plasma etching process using H₂, HCl, HBr, Cl₂, CH₄,C₂H₄, or SF₆ as an etchant gas. In an embodiment, after the secondetching process, a channel region of the fin has a sidewall with aconvex profile. In an embodiment, the first recess extends under thegate spacer. In an embodiment, portions of the source/drain region grownin the third region of the reshaped recess are farther from the dummystructure than portions of the source/drain region grown in the firstregion of the reshaped recess. In an embodiment, the second etchingprocess etches portions of the fin adjacent the first sidewall of thefin at a greater rate than the second etching process etchings portionsof the fin that are between the first sidewall of the fin and the secondsidewall of the fin. In an embodiment, after the second etching process,the first regions of the reshaped recess extend under the dummystructure.

In accordance with an embodiment, a method includes patterning asubstrate to form a strip, the strip including a first semiconductormaterial, forming an isolation region along a sidewall of the strip, anupper portion of the strip extending above a top surface of theisolation region, forming a dummy structure along sidewalls and a topsurface of the upper portion of the strip, performing a first etchingprocess on an portion of the strip to form a recess, the recess exposinga sidewall of a channel region of the strip, performing a second etchingprocess on the sidewall of the channel region, wherein after the secondetching process the sidewall of the channel region has a roundedprofile, and epitaxially growing a source/drain region in the recess. Inan embodiment, the second etching process etches exposed portions of thechannel region that are adjacent the dummy structure at a greater ratethan exposed portions of the channel region that are away from the dummystructure. In an embodiment, after the first etching process, thesidewall of the channel region is flat. In an embodiment, the firstetching process includes a first plasma etching process and the secondetching process includes a second plasma etching process that isdifferent from the first plasma etching process. In an embodiment, thesecond plasma etching process includes etching using H₂, HCl, HBr, Cl₂,CH₄, C₂H₄, or SF₆. In an embodiment, after the second etching process,the recess has a concave sidewall. In an embodiment, after the secondetching process, the recess extends under the dummy structure.

In accordance with an embodiment, a device includes a fin over asubstrate, the fin including a first end and a second end, wherein thefirst end of the fin has a convex profile, an isolation region adjacentthe fin, a gate structure along sidewalls of the fin and over the topsurface of the fin, a gate spacer laterally adjacent the gate structure,and an epitaxial region adjacent the first end of the fin. In anembodiment, the second end of the fin includes a convex profile. In anembodiment, a first distance between the first end and the second endmeasured at a sidewall of the fin is between 0.1 nm and 6 nm smallerthan a second distance between the first end and the second end measuredat the center of the fin. In an embodiment, portions of the epitaxialregion adjacent the center of the first end of the fin are farther fromthe gate structure than portions of the epitaxial region adjacent theedges of the first end of the fin.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1. A method comprising: forming a fin over a substrate, the fincomprising a first sidewall and a second sidewall opposite the firstsidewall; forming an isolation region adjacent the fin; forming a dummystructure over the fin; forming a gate spacer on a sidewall of the dummystructure; recessing the fin adjacent the dummy structure to form afirst recess using a first etching process; reshaping the first recessto form a reshaped recess using a second etching process, wherein firstregions of the reshaped recess that are adjacent the first sidewall andsecond regions of the reshaped recess that are adjacent the secondsidewall of the fin extend under the gate spacer a first distance,wherein third regions of the reshaped recess that are between the firstregions of the reshaped recess and the second regions of the reshapedrecess extend under the gate spacer a second distance, wherein the firstdistance is greater than the second distance; and epitaxially growing asource/drain region in the reshaped recess.
 2. The method of claim 1,wherein sidewalls of the first recess have a flat profile.
 3. The methodof claim 1, wherein the first distance is between 0.1 nm and 5 nmgreater than the second distance.
 4. The method of claim 1, wherein thesecond etching process comprises a plasma etching process using H₂, HCl,HBr, Cl₂, CH₄, C₂H₄, or SF₆ as an etchant gas.
 5. The method of claim 1,wherein, after the second etching process, a channel region of the finhas a sidewall with a convex profile.
 6. The method of claim 1, whereinthe first recess extends under the gate spacer.
 7. The method of claim1, wherein portions of the source/drain region grown in the third regionof the reshaped recess are farther from the dummy structure thanportions of the source/drain region grown in the first region of thereshaped recess.
 8. The method of claim 1, wherein the second etchingprocess etches portions of the fin adjacent the first sidewall of thefin at a greater rate than the second etching process etchings portionsof the fin that are between the first sidewall of the fin and the secondsidewall of the fin.
 9. The method of claim 1, wherein, after the secondetching process, the first regions of the reshaped recess extend underthe dummy structure.
 10. A method comprising: patterning a substrate toform a strip, the strip comprising a first semiconductor material;forming an isolation region along a sidewall of the strip, an upperportion of the strip extending above a top surface of the isolationregion; forming a dummy structure along sidewalls and a top surface ofthe upper portion of the strip; performing a first etching process on anportion of the strip to form a recess, the recess exposing a sidewall ofa channel region of the strip; performing a second etching process onthe sidewall of the channel region, wherein after the second etchingprocess the sidewall of the channel region has a rounded profile; andepitaxially growing a source/drain region in the recess.
 11. The methodof claim 10, wherein the second etching process etches exposed portionsof the channel region that are adjacent the dummy structure at a greaterrate than exposed portions of the channel region that are away from thedummy structure.
 12. The method of claim 10, wherein after the firstetching process, the sidewall of the channel region is flat.
 13. Themethod of claim 10, wherein the first etching process comprises a firstplasma etching process and wherein the second etching process comprisesa second plasma etching process that is different from the first plasmaetching process.
 14. The method of claim 13, wherein the second plasmaetching process comprises etching using H₂, HCl, HBr, Cl₂, CH₄, C₂H₄, orSF₆.
 15. The method of claim 10, wherein, after the second etchingprocess, the recess has a concave sidewall.
 16. The method of claim 10,wherein, after the second etching process, the recess extends under thedummy structure.
 17. A device comprising: a fin over a substrate, thefin comprising a first end and a second end, wherein the first end ofthe fin has a convex profile; an isolation region adjacent the fin; agate structure along sidewalls of the fin and over the top surface ofthe fin; a gate spacer laterally adjacent the gate structure; and anepitaxial region adjacent the first end of the fin.
 18. The device ofclaim 17, wherein the second end of the fin comprises a convex profile.19. The device of claim 17, wherein a first distance between the firstend and the second end measured at a sidewall of the fin is between 0.1nm and 6 nm smaller than a second distance between the first end and thesecond end measured at the center of the fin.
 20. The device of claim17, wherein portions of the epitaxial region adjacent the center of thefirst end of the fin are farther from the gate structure than portionsof the epitaxial region adjacent the edges of the first end of the fin.